Product

                                                               WT 5921-100T1 Thermal Gel


WT 5921-100T1is a paste-like material formulated using silicone resin as the base, combined with thermally conductive fillers and additives in specific proportions. Processed through controlled techniques, it is also known as Thermal Conductive Putty  


▶ Product Features

● High thermal conductivity, low thermal resistance

● Strong deformability, easy to adapt to product designs with large changes in thickness requirements

● Inherent tackiness, eliminating the need for adhesive products that do not enhance thermal performance to improve adhesion‌

● Excellent high temperature resistance, excellent weather resistance, radiation resistance and excellent dielectric properties

● Excellent chemical and mechanical stability

● No settling, stored at room temperature, convenient storage

● Suitable for filling irregular gaps

● Can be reworked and reused to reduce waste

● No chemical reaction required

● It has extrusion fluidity and is suitable for dispensing process


▶ Performance description

(WT 5921-100T1)  Product   Specifications

NO.

Inspection project

Performance

Test standard

1

Appearance  

Grey-White

Visual

2

Oil Exudation Rate (150*48H)

<0.01

NA

3

Density (g/cm³)

2.6

ASTM D792

4

Viscosity‌(mPa.s

254 000

GB-T 15357

5

Extrusion (g/min

125

30cc 2.54mm needle @90psi

6

Thermal ConductivityW/(m·K))

9.5

ASTM D5470

7

minimum thermal resistance (℃/W)@40PSI

0.007

ASTM D5470

8

Thermal impedance

(℃*in²/W

0.007

ASTM D5470

9

Thermal impedance(℃*cm²

0.045

ASTM D5470

10

low molecular weight   siloxane contentD4-D10)(ppm

200

WT&REACH

11

minimum bonding thicknessμm

25

WT Standard

12

Dielectric strengthV/mm50mA

<200

ASTM D149

13

Volume resistivity(Ω·cm)

1.0×1012

ASTM D257

14

Temperature   range()

-50~200

NA

15

Flame retardant rating

V-0

UL 94


▶ Thickness vs. Thermal Resistance Curve:

图片1.png


▶ Applications area

● Communication equipments

● Automobile electronic controllers

● Power supplies and semiconductors

● Memory and power modules

● Microprocessor/graphics processors

● Panel monitors, computers

● Consumer electronics


▶ Packaging and storage

●  Syringe Packaging or Other Packaging Types

●  Store at room temperature in a cool, dry place. Shelf life: 12 months


▶ Application method:

1. Pneumatic dispensing        

2. Programmed Automated Dispensing      


The above is for reference only Final process validation must align with actual application specifications and material behavior.