WT5921-32T Thermal Gel

This product is a thermal gel made of silicone resin as the base material, with special particle size control and matching thermal conductive filler, interface treatment agent and dispersant added in a certain proportion, and processed by a special process.

In thermal management applications, it can provide excellent thermal conductivity with a minimum thickness of 0.02mm after being compressed. This product has good shear thinning properties and can form a uniform thin layer under pressure. It is mainly used for thermal conductivity at the interface of TIM1 chips and as a TIM2 between heat sinks and heat sources to provide heat transfer in small spaces.

▶ Features

● Strong insulation

● No need for curing, better protection of circuit structure and sensitive connections

● Superior high temperature resistance, excellent weather resistance, radiation resistance, and superior dielectric performance

● Superior chemical and mechanical stability, solvent-free, and no need for chemical reactions

● Suitable for ultra-low thickness workspaces

● Has extrusion fluidity and is suitable for dispensing process

● No settling, room temperature storage, convenient storage

● Suitable for surface shape and gap filling thermal conductivity of various types of devices

● Extremely low volatility ensures that optical components are always clear

● High thermal conductivity and low thermal resistance

▶ Parameter Index

▶ Typical application

● Seal of semiconductor chip

● Seal of power semiconductor module

● Optical modules

● Security monitoring

● Projector

● AR glasses

●  Sport camera